Qualcomm has revealed details on the company’s latest flagship smartphone chip — Snapdragon 845, the successor of the 835. The new chip will have the same 10nm manufacturing process as the 835 and will use Qualcomm’s latest gigabit LTE (x20) and Wi-Fi modems for connectivity. The new chip will be the company’s first SoC to have an SPU (secure processing unit), it is a new subsystem designed to protect data about your fingerprints, iris, mobile payments, SIM, and more.
The company has done a good job with imaging by upgrading to Spectra 280 ISP. With this Snapdragon 845 will be able to capture 4K video in HDR up to 60 frames per second, shoot slow motion 720p video(s) at 480 frames per second and 240 frames per second 1080p video. The Spectra 280 ISP will also able to perform multi frame noise reduction on 16-megapixel images at 60 frames per second when taking still images and includes InMotion, a feature that uses still photography and video capture to superimpose a still image on a moving background. It also supports a wider GAMUT compared to its predecessor.
Another improvement is the Adreno 630 GPU which the company claims would improve graphics and power efficiency by a whopping 30%. This would give your phone a 3% performance boost.
Moreover, the “True-wireless” Bluetooth 5 system will allow a single device broadcast audio to several speakers or headphones simultaneously. In addition to this, the company claims that this system can increase power consumption by 50% for wireless headphones. The new chip has improved in terms of battery too with the company promising a power reduction by at least one third for “energy hungry” features like AR/VR gaming.
The new chip has already been shipped out to manufacturers and we would probably see them in the next Flagship phones that are rolled out next year like Huawei for instance which has already stated its intention in using the use the chip.